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        With the development of modern information technology,The integration density of functional chips is getting higher and higher,The density of silicon-based chip integrated devices has exceeded2billion transistors per square millimeter。at present,Integrated circuit chips are mainly made of monocrystalline silicon。Compared with silicon materials,Organic semiconductor materials are intrinsically flexible、biocompatibility、Low cost and other advantages,in wearable electronic devices、Emerging fields such as bioelectronic devices have important application prospects,It is a semiconductor material with important application prospects。However,Organic chips based on organic semiconductors lag far behind silicon-based chips in terms of integration.。

Fudan University website news,A few days ago,Department of Polymer Science, Fudan University、Wei Dacheng's team at the State Key Laboratory of Polymer Molecular Engineering designed a functional photoresist,Integrated on a full-frame size chip using photolithography technology2700Thousands of organic transistors and interconnected,Integration reaches ultra-large scale integration(ultra-large-scale integration,ULSI)level。

2024Year7moon4day,This result is based on《High-performance large-scale integrated organic phototransistors based on photovoltaic nanounits》(“Photovoltaic nanocells for high-performance large-scale-integrated organic phototransistors”)Published under the title《nature·nano technology》(Nature Nanotechnology)。

(a)Photoresist composition;(b)Photoresist aggregate structure;(c)Organic transistor arrays fabricated on different substrates；(d)Schematic diagram of organic transistor array structure and optical microscope photos；(e)Organic phototransistor imaging chip(PQD-nanocell OPT)Use with existing commercialCMOSComparison of pixel density of imaging chips and other methods of manufacturing organic imaging chips。

According to the team,Chip integration can be divided into small-scale integration(SSI)、Medium scale integration(MSI)、Massive integration(LSI)、Very large scale integration(VLSI)and extremely large-scale integration(ULSI),The number of integrated devices on a single chip is greater than2、26、211、216、221。

previously,The manufacturing method of organic chips mainly includes screen printing、inkjet printing、Vacuum evaporation、Photolithography processing, etc.,Integration usually only reaches large-scale integration(LSI)level。Organic semiconductor conductive channels formed by stacking van der Waals forces are corroded by various solvents and thermal treatments during complex manufacturing processes.,Leading to a significant reduction in chip performance,Especially as feature sizes go down to microns and below,Performance degradation is particularly significant。Due to the trade-off between miniaturization and performance,The development of highly integrated organic chips is limited。

Wei Dacheng's team has long been committed to new transistor materials、Device and sensing application research。in research,They designed a photoinitiator、Cross-linking monomer、New functional photoresist composed of conductive polymers,Achieve new breakthroughs in the integration of polymer semiconductor chips。

According to reports,Photoresist is also called photoresist,Plays a key role in chip manufacturing,after exposure、Processes such as development can transfer the required fine patterns from the mask to the substrate to be processed,It is a basic material for photolithography process.。Traditional photoresist only serves as a processing template,Not conductive by itself、Sensing and other functions,This new functional photoresist forms a nanoscale interpenetrating network structure after photo-crosslinking.,Combined with good semiconductor performance、Photolithography processing performance and process stability,Not only can reliable manufacturing of sub-micron feature size patterns be achieved,,And the pattern itself is a semiconductor,Simplified chip manufacturing process。

This photoresist can achieve different sensing functions by adding sensing receptors。In order to achieve high-sensitivity photoelectric detection function,The team loaded core-shell structured nanoparticles with photovoltaic effects into the photoresist material.。under light,Nanophotovoltaic particles generate photogenerated carriers,Electrons are captured by the core,Generate in-situ grating control,Greatly improves the responsiveness of the device。Photolithographically fabricated organic transistor interconnect arrays containing4500×6000pixels,The integration density reaches3.1×106Units per square centimeter,That is, integrated on a full-frame size chip2700Thousands of devices,Reach extremely large-scale integration(ULSI),Its photoresponsivity reaches6.8×106Amperes per Watt,High-density arrays can be transferred to flexible substrates,Bionic retina application realized。

at present,The team also developed a chemical-sensing、Photoresist for bioelectric sensing function。This study proposes a structural design strategy for functional photoresists,It is expected to promote the development of highly integrated organic chips.。After years of technology accumulation,The organic chips prepared by the team have reached the international leading level in terms of integration.,The technology is highly compatible with commercial microelectronics manufacturing processes,Has good application prospects。

“We are actively seeking cooperation with the industry,Hope to promote the application and transformation of scientific research results。future,On the one hand, this material can be used to manufacture highly integrated flexible chips.,On the other hand due to its lithography compatibility,It is also possible to achieve functional integration of organic chips and silicon-based chips,Further expand the application of silicon-based chips。”Team leader Wei Dacheng said。

The State Key Laboratory of Polymer Molecular Engineering, Department of Polymer Science, Fudan University, is the first unit of the paper.,Zhang Shen, a doctoral candidate in the Department of Polymer Science at Fudan University, is the first author.,Researcher Wei Dacheng of Fudan University is the corresponding author.。also,Researcher Yang Yingguo, School of Microelectronics, Fudan University、Academician Liu Yunqi from the Department of Materials Science of Fudan University and others participated in the research。The research work was supported by the National Key R&D Program、National Natural Science Foundation of China、Supported by Shanghai Municipal Science and Technology Commission and Fudan University。